High Speed Film Thickness Mapping System
Measures 49 sites in 30 Seconds.
FEATURES
Tilt-free, focus free, hands-off operation for similar wafers.
Fastest possible instrument for thin film measurement.
Variable angle available for difficult to measure films.
Trouble-free, no moving parts patented StokesMeterTM measurement head.
Accurate, stable measurements using spectrally precise laser ellipsometry.
Simple, compact tabletop instrument - competitively priced.
L115WH Wafer Handler
FEATURES
Unattended automatic measurement of up to 25 wafers
User selection of Sequential or Random Access mode
Gentle, accurate handling of 4" to 12" wafers
Clean, non-contaminating operation with no belts or air tracks and no sliding or bumping of the wafer
Model L115WH Wafer Handler permits unattended automatic measurement of up to 25 wafers from a cassette. The random access indexer on the Wafer Handler is ultra clean with the mechanism fully contained within the housing so there are no moving parts near the wafer. The "frog-leg" type motion of the arm is simple, clean and gentle. An optional Wafer Aligner (L115WHA) can also be added to the Wafer Handler to orient the wafer on the ellipsometer stage.
* All software is in Windows 95 bundle. |
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